Advanced Flip Chip Packaging

Advanced Flip Chip Packaging

4.11 - 1251 ratings - Source

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.6.4 Schematic illustration of the formation of electrical interconnects between a bumped chip and a mating carrier using a ... (d) Bi diffuses into the Sna€“Pb matrix and form fine solid precipitates ACA Bumped Flip Chips on Glass Chipanbsp;...

Title:Advanced Flip Chip Packaging
Author: Tong Ho-Ming, Yi-Shao Lai, C.P. Wong
Publisher:Springer Science & Business Media - 2013-03-20

You must register with us as either a Registered User before you can Download this Book. You'll be greeted by a simple sign-up page.

Once you have finished the sign-up process, you will be redirected to your download Book page.

How it works:
  • 1. Register a free 1 month Trial Account.
  • 2. Download as many books as you like (Personal use)
  • 3. Cancel the membership at any time if not satisfied.

Click button below to register and download Ebook
Privacy Policy | Contact | DMCA